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How to bid mechanical insulation – Part 1 This first installment of the Autodesk series will help you understand how to bid a mechanical engineering. I’m doing The Old Stuff Now.1. Field of the Invention
The present invention relates to a semiconductor integrated circuit and a method of manufacturing the same.
2. Description of the Related Art
An LSI (Large Scale Integration) element is fabricated by a wiring technique of using a film with a thickness of a few nanometers for a wiring interconnect or a wiring material. This technique is called a damascene technique. In the damascene technique, a hole is formed in an insulating film, and a wiring is formed by filling the hole. A wiring formed by this technique is also called a via.
One or more holes are formed in a predetermined region in a wiring pattern, and then a wire film with a thickness of a few nanometers for a wiring interconnect is formed on the pattern. After that, the wire film is patterned. This technique is called a dual damascene technique.This invention relates to a roll-bonded glass film and a laminate of a glass film, metallic foil and plastic film.
Resin films used for a solar cell, a liquid crystal display, a plasma display, a solar cell back sheet, a safety glass, a check, an ATM (Automated Teller Machine), a check printer and a handy camera, are required to have the function that they have an excellent chemical resistance. Additionally, the films are required to have a good film formability of giving a continuous film with no disturbance or trouble in the case that they are wound on a core. Furthermore, they are required to have an excellent barrier function and a stable handling performance.
As for the solar cell, a metal ribbon of stainless steel or a ceramic ribbon is used in many cases as a core of the cell. A resin film such as a polyvinyl fluoride (PVF) or a polyvinylidene fluoride (PVDF) is used as a solar cell protective film or a cell cover. However, these cores and
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